YCS 138°C LOW-TEMPERATURE LEAD-FREE SOLDER PASTE

Paste & Glue & Liquid & Flux

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YCS 138°C LOW-TEMPERATURE LEAD-FREE SOLDER PASTE

R 70

YCS 138 degree low-temperature lead-free solder paste syringe for iPhone and Android motherboard middle layer reballing and BGA repair

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SKU: GSM-YCS-138-C-LOW-TEMPERATURE-LEAD-292 Category:
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YCS 138 degree low-temperature lead-free solder paste syringe for iPhone and Android motherboard middle layer reballing and BGA repair

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