RELIFE HW21S SILVER SERIES 183°C SOLDER PASTE – 10CC SYRINGE-PACKED HIGH-CONDUCTIVITY BGA REBALLING TIN FOR IPHONE & ANDROID LOGIC BOARDS

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RELIFE HW21S SILVER SERIES 183°C SOLDER PASTE – 10CC SYRINGE-PACKED HIGH-CONDUCTIVITY BGA REBALLING TIN FOR IPHONE & ANDROID LOGIC BOARDS

R 70

RELIFE HW21S silver series 183C solder paste 10CC syringe for professional BGA reballing

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SKU: GSM-RELIFE-HW21S-SILVER-SERIES-183-C-134 Category:
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RELIFE HW21S silver series 183C solder paste 10CC syringe for professional BGA reballing

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PlaceholderRELIFE HW21S SILVER SERIES 183°C SOLDER PASTE – 10CC SYRINGE-PACKED HIGH-CONDUCTIVITY BGA REBALLING TIN FOR IPHONE & ANDROID LOGIC BOARDS
R 70
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