RELIFE HW21 183°C MEDIUM-TEMPERATURE SOLDER PASTE – PROFESSIONAL LEADED BGA REBALLING FLUX FOR IPHONE & ANDROID MOTHERBOARD REPAIR

Paste & Glue & Liquid & Flux

Awaiting product image

RELIFE HW21 183°C MEDIUM-TEMPERATURE SOLDER PASTE – PROFESSIONAL LEADED BGA REBALLING FLUX FOR IPHONE & ANDROID MOTHERBOARD REPAIR

R 70

RELIFE HW21 183 degree Celsius medium temperature solder paste for BGA reballing and motherboard repair

- +
SKU: GSM-RELIFE-HW21-183-C-MEDIUM-TEMPERATURE-133 Category:
Product Tested
Certified Product
100% Genuine Product

RELIFE HW21 183 degree Celsius medium temperature solder paste for BGA reballing and motherboard repair

Reviews

There are no reviews yet.

Be the first to review “RELIFE HW21 183°C MEDIUM-TEMPERATURE SOLDER PASTE – PROFESSIONAL LEADED BGA REBALLING FLUX FOR IPHONE & ANDROID MOTHERBOARD REPAIR”

Your email address will not be published. Required fields are marked *

Related products

Shopping Cart
PlaceholderRELIFE HW21 183°C MEDIUM-TEMPERATURE SOLDER PASTE – PROFESSIONAL LEADED BGA REBALLING FLUX FOR IPHONE & ANDROID MOTHERBOARD REPAIR
R 70
- +
Scroll to Top